Optimization of pin through hole connector in thermal fluid–structure interaction analysis of wave soldering process using response surface methodology

• We carry out the optimization of pin through hole in the wave soldering process.
• Real-time thermal FSI analysis is performed by using FLUENT, ABAQUS and MpCCI.
• The most significant factors to the responses are revealed in the study.
• The interactive relationship between physical and process parameters are studied.

This paper presents an optimization of pin through hole (PTH) connector in the wave soldering process; the optimization was performed by using response surface methodology. The geometrical and process parameters (i.e., offset position, pin diameter, offset angle, and solder temperature) were optimized by using response surface methodology via central composite design for the wave soldering process. Thermal fluid–structure interaction aspects were considered in the optimization. A mesh-based parallel code-coupling interface was employed to connect both fluid and structural solvers. The interactive relationship between independent variables (i.e., offset position, pin diameter, offset angle, and solder temperature) and the responses (i.e., filling time at 75% volume, von Mises stress, and maximum displacement) were investigated. The generated empirical models were examined and well substantiated by the simulation results. The optimum geometrical and process parameters of the wave soldering process for the PCB and PTH connector were as follows: 0.12 mm of PTH offset position, 0.17 mm of PTH diameter, 0° of offset angle, and 473 K of molten solder temperature.