کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
4993051 1457475 2016 7 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
A novel flow arrangement of staggered flow in double-layered microchannel heat sinks for microelectronic cooling
ترجمه فارسی عنوان
تنظیم جریان جدید جریان جریانی در گرمای میکرو کانال دو لایه برای خنک سازی میکرو الکترونیک غرق می شود
کلمات کلیدی
جریان تقسیم شده، میکروفن دو لایه توزیع دما، مقاومت حرارتی، قدرت پمپاژ،
موضوعات مرتبط
مهندسی و علوم پایه مهندسی شیمی جریان سیال و فرایندهای انتقال
چکیده انگلیسی
A novel flow arrangement of staggered flow (the fluid staggers flow along each layer) is presented to remove higher heat flux and obtain more uniform bottom temperature in double-layered microchannel heat sinks. Compared to the counter flow, the heat transfer performance of two types of staggered flow is studied numerically. The distribution of the total temperature, average bottom temperature, maximum temperature difference and thermal resistance is presented for different flow arrangements under similar pumping power. The results show that the flow arrangement with staggered flow 2 (the fluid flows along the x direction at the second layer, while fluid staggers along the y direction at the first layer) provides the lowest maximum and most uniform temperature under similar working condition. Moreover, the thermal resistance of staggered flow 2 is much lower than that of counter flow and staggered flow 1 under the similar pumping power, which indicates that it has better cooling capacity for microelectronic cooling.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: International Communications in Heat and Mass Transfer - Volume 79, December 2016, Pages 98-104
نویسندگان
, , , ,