A thermally-actuated latching MEMS switch matrix and driver chip for an automated distribution frame

This paper presents a thermally-actuated latching MEMS switch matrix together with an integrated driver chip for controlling these switches. The novel thermal actuators are heated by making use of a polysilicon heater underneath the structure, which results in a more stable actuation and a facilitated driving. The designed driver can generate adjustable latching waveforms which are needed to latch the switch into a closed or open state. As the thermal actuators in the MEMS switch require voltages up to 24 V, the high-voltage 0.35 µm  I3T50 technology of ON Semiconductor was used to fabricate the device. The driver, measuring 2 × 2 mm2, contains 32 output drivers and can control a 4 × 4 latching switch matrix. This driver chip together with the latching MEMS switches were combined to create a prototype 2 × 2 double-pole single-throw latching MEMS switch matrix. The proposed MEMS switch matrix could be used in the fixed-access telecommunication network in which it can implement a compact automated distribution frame for connecting twisted pairs.