Silicon-based multi-functional wafer-level-package for LEDs in 7-mask BiCMOS process

- A multi-functional wafer level package for white LED system has been designed and manufactured.
- 7-mask BiCMOS process was applied to simply manufacture all package units.
- All sensors (temperature and blue selective light sensors) were integrated in the package.
- Each sensor has been designed, characterized and calibrated to be part of the smart monitoring unit.
- An interdigitated power transistor and a 4-bit flash ADC were also monolithically integrated.

Today, finding a low cost, efficient, functional and reliable solution for controlling smart lighting systems has become topic of many research groups and industry. In this study, a multi-functional wafer level package (WLP) for phosphor-based white LED system has been designed and manufactured using 7-mask BiCMOS process. This package integrates 4 high power blue LED dies with a temperature sensor and a blue selective light sensor for monitoring system performance. Each sensor has been designed, characterized and calibrated to be part of the smart monitoring unit. An interdigitated power transistor and a 4-bit flash analog-to-digital converter (ADC) were also monolithically integrated with sensors' readout and extra controlling functions.