Dual BIE approaches for modeling electrostatic MEMS problems with thin beams and accelerated by the fast multipole method

Three boundary integral equation (BIE) formulations are investigated for the analysis of electrostatic fields exterior to thin-beam structures as found in some micro-electro-mechanical systems (MEMS). The three BIE formulations are: (1) the regular BIE using only the single-layer potential; (2) the dual BIE (a) using the regular BIE on one surface of a beam and the gradient BIE on the other surface; and (3) the dual BIE (b) using a linear combination of the regular BIE and gradient BIE on all the surfaces of the beam. Similar to crack problems in elasticity, the regular BIE degenerates when the beam thickness tends to zero, while the two dual BIE formulations do not degenerate. Most importantly, the dual BIE (b) is found to be well conditioned for all the values of the beam thickness, and thus well suited for implementation with the fast multipole BEM. The fast multipole BEM for both the regular BIE and the dual BIE (b) formulations are developed and tested on a simplified comb-drive model. The numerical results clearly show that the dual BIEs are very effective in solving MEMS problems with thin beams and the fast multipole BEM with the dual BIE (b) formulation is very efficient in solving large-scale MEMS models.