Energy-rate consideration in wafer bonding

In the present study, we consider the bonding process of a pair of wafers with rough surfaces via an energy-rate concept in which “rate” refers to “area rate”. A finite element numerical simulation for a rough surface with periodical distributed asperities bonded onto a rigid half-space is carried out for demonstrating the energy-rate concept. The simulation reveals various phenomena in the wafer bonding, such as self-activated bonding, asperity shape effect and plastic deformation effect in the bonding process.