کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
5446546 | 1511137 | 2016 | 6 صفحه PDF | دانلود رایگان |
Light-induced plating (LIP)of Ni/Cu presents a potentially lower-cost alternative to screen-printed Ag for silicon solar cell metallization. This paper presents results of self-annealing and post-plating rapid thermal processing (RTP) of plated Cu finger microstructure, texture and resistance. It is shown that the plated Cu conductors, if not thermally-annealed immediately after plating, self-anneal with time resulting in grain growth and increased (200) to (111) grain texture which occurs with increased tensile stress. Post-plating RTP annealing enables fast annealing and stable Cu fingers with a low ratio of (200) to (111) grain texture. These findings have important implications for plated finger adhesion and highlight the importance of annealing after plating for reliable Cu plated metallization.
Journal: Energy Procedia - Volume 98, November 2016, Pages 136-141