Electromagnetic incremental forming of integral panel under different discharge conditions

A method for forming panels through the electromagnetic incremental forming (EMIF) process with coil shifting is presented in this study. The forming effect of the panels under different EMIF process conditions was explored through experiments. The results show that the two consecutive discharges method of a small voltage followed by a high voltage in a fixed position was helpful for improving the forming depth and shape deviation to die of the panel; the increase of the capacitance over a certain range was helpful for improving the forming depth; a large position distance was beneficial to improve the forming depth; and a loading path of “side-midst-side” with a large discharge voltage in the subsequent position could effectively improve the forming depth and shape deviation to die. These forming rules show that EMIF is feasible for forming panels using a suitable loading path with reasonable capacitance and discharge positions combined with two consecutive discharges of a small voltage followed by a high voltage in a fixed position.