Evaluation of coating thickness by thermal wave imaging: A comparative study of pulsed and lock-in infrared thermography - Part I: Simulation

This paper investigates the possibilities of evaluating non-uniform coating thickness using thermal wave imaging method. A comparative study of pulsed thermography (PT) and lock-in thermography (LIT) based on evaluating the accuracy of predicted coating thickness is presented. In this study, a transient thermal finite element model was created in ANSYS 15. A single square pulse heating for PT and a sinusoidal heating at different modulation frequencies for LIT were used to stimulate the sample according to the experimental procedures. The response of thermally excited surface was recorded and data processing with Fourier transform was carried out to obtain the phase angle. Then calculated phase angle was correlated with the coating thickness. The method demonstrated potential in the evaluation of coating thickness and was successfully applied to measure the non-uniform top layers ranging from 0.1 mm to 0.6 mm; within an accuracy of 0.0003-0.0023 mm for PT and 0.0003-0.0067 mm for LIT. The simulation model enabled a better understanding of PT and LIT and provided a means of establishing the required experimental set-up parameters. This also led to optimization of experimental configurations, thus limiting the number of physical tests necessary.