Direct Write Processing of Multi-micron Thickness Copper Nano-particle Paste on Flexible Substrates with 532 nm Laser Wavelength

The Laser Assisted Direct Write (LA-DW) method has been implemented in the development of different markets and material processing, recently also used for creating Printed Circuit Boards (PCB) or electrical circuitry. The process consists in the deposition of metallic nano-particle (NP) inks, which are afterwards cured or sintered by laser irradiation, thus creating conductive pathways; advantages are speed, accuracy and the protection of the heat affected zone (HAZ). This research will study the behaviour of the heat dissipation relatively within the Nano-particle Copper paste after being irradiated with 1064 nm and 532 nm wavelengths, research will be developed on different widths and depths deposited onto flat surfaces such as flexible PET. Comparisons to be made between resistivity results obtained from different wavelengths.