Superhydrophilic surface modification of copper surfaces by Layer-by-Layer self-assembly and Liquid Phase Deposition of TiO2 thin film

A new method has been developed for the superhydrophilic surface modification of copper using versatile solution-based fabrication techniques. The high surface area of TiO2 nanoparticles was exploited to create a thin film with increased surface energy that transformed copper materials from relatively hydrophobic to superhydrophilic. Copper exposed to ambient conditions resulting in a thin layer of copper oxide has a water contact angle near 90°, but following TiO2 modification, the contact angle dropped to 0°. The thin film responsible for this drastic improvement in wettability proved durable by retaining its excellent properties throughout an extended application of thermal stress. SEM and Raman Spectroscopic analysis confirmed the structural integrity of the film before and after a durability test.

A new method was developed for the superhydrophilic surface modification of copper using versatile solution-based fabrication techniques including Layer-by-Layer self-assembly and Liquid Phase Deposition.Figure optionsDownload high-quality image (96 K)Download as PowerPoint slideResearch highlights
► Hydrophilic films can enhance the efficiency of copper cooling devices.
► TiO2 thin film changes copper from hydrophobic to superhydrophilic.
► LbL and TiO2 LPD hybrid film demonstrates excellent adhesion and 0° contact angle.
► Temperature-controlled nanoparticle growth characteristics determine robustness.
► Properly grown dense thin films remain resilient under harsh thermal stress.