Role of microstructure on surface and subsurface damage of sintered silicon carbide during grinding and polishing

▶ More grain pulling-out in equiaxed grain (EQ) than in elongated grain (EL) of S-SiC. ▶ Grain pulling-out is related to aspect ratio and grain diameter. ▶ Only plastic deformation in EL during polishing. ▶ Brittle fracture during grinding while plastic deformation during polishing in EL.