Understanding the copper underpotential deposition process at strained gold surface

- The electrodeposition potential is strain-dependent for copper UPD on gold surface.
- The coupling strength of UPD and strain is quantified by a coupling coefficient, ς.
- Coupling coefficient is related to the structural differences.
- Mechanical strain could enhance electrodeposition.

Copper underpotential deposition (UPD) on a gold surface is investigated by cyclic voltammetry coupled with in situ cyclic strain to understand the strain-modulated electrodeposition. Our work emphasizes quantification of an electrocapillary coupling coefficient ς, which relates the response of Cu electrodeposition potential, E, to applied strain, ε. The different responses to the strain are observed at two Cu UPD stages. The data indicate that tensile strain could enhance the formation of a Cu monolayer on the Au surface. The typical electrodeposition process could be modulated by an external mechanical strain.

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