Heat transfer enhancement in a micro-channel cooling system using cylindrical vortex generators

Three-dimensional conjugate heat transfer under laminar flow conditions within a micro-channel is analysed numerically to explore the impact of a new design of vortex generator positioned at intervals along the base of the channel. The vortex generators are cylindrical with quarter-circle and half-circle cross sections, with variants spanning the whole width of the channel or parts of the channel. Micro-channels with Reynolds number ranging from 100 to 2300 are subjected to a uniform heat flux relevant to microelectronics cooling. To ensure the accuracy of the results, validations against previous microchannel studies were conducted and found to be in good agreement, before the new vortex generators with radii up to 400 μm were analysed. Using a thermal–hydraulic performance parameter expressed in a new way, the VGs described here are shown to offer significant potential in combatting the challenges of heat transfer in the technological drive towards lower weight/smaller volume electrical and electronic devices.