Electroless copper plating using dimethylamine borane as reductant

► The high pH values (10-12.5) promote the oxidation of DMAB, and suppress the reduction of the copper ion. ► Results for a dual-chelating agent system indicate that 1,5,8,12-tetraazadodecane plays an important role in chelation. ► The main effect of TEA is adsorption on copper surfaces to inhibit DMAB oxidation and to promote deposition.