A quantitative thermal and thermomechanical analysis for design optimization and robustness assessment of microassembled high power Yb:CaF2 thin-disk Laser

While considerable effort in the field of high power laser research has been dedicated to evolving thin-disk Lasers into the kilowatt range, thermal and residual stress management remain a critical issue and need to be addressed. In this paper, a quantitative thermal and thermomechanical analysis is presented for design optimization and robustness of high power diode pumped thin-disk ytterbium Lasers based on thermal and thermomechanical Finite Element Method (FEM) simulations. In particular, Yb:CaF2 Lasers are examined with respect to the design and selection of the bonding interface material. Results propose the use of a metallic Au80Sn20 hard solder of greater than 20 µm thickness as a superior solution to adhesive bonding for the prevention of Laser crystal failure under high optical pumping power while maintaining sufficient resistance to mechanical strain. Thermal IR characterizations under “safe” CW pumping power validate our predicted FEM Multiphysics models. Finally, an essentially void-free Au80Sn20 soldering process has been demonstrated for the mounting of Yb:CaF2 crystals onto a CuW heat sink.