Dynamic temperature prediction of electronic equipment under high altitude long endurance conditions

Unmanned Aerial Vehicle (UAV) is developing towards the direction of High Altitude Long Endurance (HALE). This will have an important influence on the stability of its airborne electronic equipment using passive thermal management. In this paper, a multi-node transient thermal model for airborne electronic equipment is set up based on the thermal network method to predict their dynamic temperature responses under high altitude and long flight time conditions. Some relevant factors are considered into this temperature prediction model including flight environment, radiation, convection, heat conduction, etc. An experimental chamber simulating a high altitude flight environment was set up to survey the dynamic thermal responses of airborne electronic equipment in a UAV. According to the experimental measurement results, the multi-node transient thermal model is verified without consideration of the effects of flight speed. Then, a modified way about outside flight speed is added into the model to improve the temperature prediction performance. Finally, the corresponding simulation code is developed based on the proposed model. It can realize the dynamic temperature prediction of airborne electronic equipment under HALE conditions.