کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
7169792 | 1463095 | 2015 | 12 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Development of single cantilever beam method to measure the adhesion of thin film adhesive on silicon chip
ترجمه فارسی عنوان
توسعه یک روش پرتوهای تک کانال برای اندازه گیری چسبندگی فیلم چسب نازک بر تراشه سیلیکون
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کلمات کلیدی
چسبندگی کششی، پرتو تک کانال مقاومت برشی، فیلم ضرب و شتم، بسته الکترونیکی
موضوعات مرتبط
مهندسی و علوم پایه
سایر رشته های مهندسی
مهندسی مکانیک
چکیده انگلیسی
A method to measure the tensile adhesion of thin films on a silicon chip was developed. A new test machine was designed to obtain tensile adhesion by applying a single cantilever beam method. Self-alignment of the specimen was accomplished by a specially designed jig and mount. The specimen was designed to allow fabrication by using a commercial manufacturing process. The developed method was applied to measure the adhesion of die attach films having various thicknesses ranging from 5 μm to 20 μm. Adhesion between the film adhesive and the top surface of a silicon chip was successfully measured. It was shown that the measured adhesion was independent of crack length and robust against variation of the initial alignment of specimen.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Engineering Fracture Mechanics - Volume 133, January 2015, Pages 179-190
Journal: Engineering Fracture Mechanics - Volume 133, January 2015, Pages 179-190
نویسندگان
DongKil Shin, JungJu Lee, ChulKeun Yoon, GyuJei Lee, JoonKi Hong, NamSuk Kim,