Rapid sintering of nano-Ag paste at low current to bond large area (>100 mm2) power chips for electronics packaging

Rapid sintering of nano-Ag paste at low current to bond large area (>100 mm2) power chips for electronics packaging

Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Journal of Materials Processing Technology - Volume 255, May 2018, Pages 644-649

Yijing Xie, Yanjie Wang, Yunhui Mei, Haining Xie, Kun Zhang, Shuangtao Feng, Kim S Siow, Xin Li, Guo-Quan Lu,