Detachment of an adhered micropillar from a dissimilar substrate

Interfacial failure is predicted for an assumed crack emanating from the corner of pillar and substrate. For the case of an interfacial crack that resides within the domain of corner singularity, a boundary layer analysis is performed to calculate the dependence of the interfacial stress intensity factor K upon (H1,H2). When the crack extends beyond the domain of corner singularity, it is necessary to consider the full geometry in order to obtain K. A case study explores the sensitivity of the pull-off stress to the flaw size and to the degree of material mismatch. The study has implications for the optimum design of adhesive surface micropatterns, for bonding to either stiffer or more compliant substrates.