Accelerated temperature cycling induced strain and failure behaviour for BGA assemblies of third generation high Ag content Pb-free solder alloys

Accelerated temperature cycling induced strain and failure behaviour for BGA assemblies of third generation high Ag content Pb-free solder alloys

Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Materials & Design - Volume 154, 15 September 2018, Pages 184-191

Eric Dalton, Guang Ren, Jeff Punch, Maurice N. Collins,