Microstructure evolution and mechanical properties of transient liquid phase bonded Ti-6Al-4V joint with copper interlayer

Microstructure evolution and mechanical properties of transient liquid phase bonded Ti-6Al-4V joint with copper interlayer

Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Materials & Design - Volume 92, 15 February 2016, Pages 1-7

Yongqiang Deng, Guangmin Sheng, Fangli Wang, Xinjian Yuan, Qi An,