Microstructure and mechanical properties of Pb-free Sn-3.0Ag-0.5Cu solder pastes added with NiO nanoparticles after reflow soldering process

Scenario of IMCs formation for Sn-3.0 wt.% Ag-0.5 wt.% Cu-x wt.% NiO nanocomposite solder paste during reflow soldering process.173