Enhancing tensile strength of Cu by introducing gradient microstructures via a simple torsion deformation

Enhancing tensile strength of Cu by introducing gradient microstructures via a simple torsion deformation

Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Materials & Design - Volume 90, 15 January 2016, Pages 545-550

Ning Guo, Bo Song, Hongbing Yu, Renlong Xin, Bingshu Wang, Tingting Liu,