Development of the new IC decapsulation technology

► A new hybrid process, which combined laser processing and wet etching, is proposed to IC molding removal. ► The relationship between processing condition and the processed surface quality is reported, and the removal processes are considered in each laser wavelength to select a suitable laser source. ► The new molding thickness-monitoring system is developed with the selected laser source. ► The hybrid process is carried out. The processing time and the volume of chemical solution used a process are compared with a conventional process.