کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
736768 893890 2009 7 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Estimation of thermal parameters of the enclosed electronic package system by using dynamic thermal response
موضوعات مرتبط
مهندسی و علوم پایه سایر رشته های مهندسی کنترل و سیستم های مهندسی
پیش نمایش صفحه اول مقاله
Estimation of thermal parameters of the enclosed electronic package system by using dynamic thermal response
چکیده انگلیسی

A methodology for modeling and simulating the electro-thermal behavior of an enclosed electronic package is presented and validated. The electro-thermal model is constructed using system dynamics. The system model, in which the electrical and the thermal domain are combined, is presented. The developed model describes the dynamic thermal behavior system that was an electronic device in the test enclosure. An effective way to identify the thermal parameters of the system, especially the thermal contact resistance, is suggested. In detail, the new method for thermal resistance identification is based on the temperature difference behavior between the component and the air temperature inside the enclosure. Based on the proposed model, either the variation of the heat source or the ambient temperature can be estimated. Simulated results were in good agreement with the measured temperature in the transient state accompanying with the variation of the environment.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Mechatronics - Volume 19, Issue 6, September 2009, Pages 1034–1040
نویسندگان
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