کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
737188 | 893916 | 2008 | 5 صفحه PDF | دانلود رایگان |
![عکس صفحه اول مقاله: Adhesive bonding with SU-8 in a vacuum for capacitive pressure sensors Adhesive bonding with SU-8 in a vacuum for capacitive pressure sensors](/preview/png/737188.png)
This paper describes a method for fabricating capacitive pressure sensors through the use of adhesive bonding with SU-8 in a vacuum. The influence of different parameters on the bonding of structured wafers was investigated. It was found that pre-bake time, pumping time, and the thickness of the crosslink layer are the most important factors for successful bonding. Bonding quality was evaluated by inspection through the transparent glass of the sensor and through the use of an SEM photograph, with 90% of the area successfully bonded and an ultimate yield of 70% of the sensors. The measured bonding strength was 17.15 MPa and 19.6 MPa for wafers bonded in 80 °C and 100 °C, respectively. The pressure–capacitance characteristic test results show that this bonding process is a viable micro electro mechanical systems (MEMS) fabrication technology for cavity sealing in a vacuum.
Journal: Sensors and Actuators A: Physical - Volume 147, Issue 2, 3 October 2008, Pages 672–676