Study on triple-stack anodic bonding using two electrodes

The principle of two-step triple-stack anodic bonding using two electrodes is presented. Experimental study on anodically bonding pyrex glasses and silicon stacks of glass–silicon–glass structure is performed. Current character during this bonding process especially during the second bonding process is studied. Sodium clustering as yellow-brown point in glass is studied using SEM and EDAX apparatus. De-bonding effect at first bonded interface during second bonding process is studied. And strength testing of bonded triple stacks is performed, the results shows that this bonding method is suitable for most of MEMS packaging.