کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
738554 | 894016 | 2006 | 7 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
In-process gap reduction of capacitive transducers
دانلود مقاله + سفارش ترجمه
دانلود مقاله ISI انگلیسی
رایگان برای ایرانیان
موضوعات مرتبط
مهندسی و علوم پایه
شیمی
الکتروشیمی
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: In-process gap reduction of capacitive transducers In-process gap reduction of capacitive transducers](/preview/png/738554.png)
چکیده انگلیسی
This paper presents a MEMS fabrication technique for reducing the trench width of microstructures below the technological limitations of the deep reactive ion etching (DRIE) process, in order to increase the aspect ratio of the sensing electrode gap of capacitive transducers. The in-process trench width reduction is based on the displacement of a substructure actuated by a buckling beam mechanism. Compressive stress causes a longitudinal force in the acting beams which results in the buckling to a predefined direction. This way, the capacitive sensitivity and hence the signal to area ratio of a transverse comb structure could be increased by a factor of 5.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Sensors and Actuators A: Physical - Volume 126, Issue 1, 26 January 2006, Pages 211–217
Journal: Sensors and Actuators A: Physical - Volume 126, Issue 1, 26 January 2006, Pages 211–217
نویسندگان
Danny Reuter, Andreas Bertz, Detlef Billep, Dirk Scheibner, Wolfram Dötzel, Thomas Gessner,