Stroboscopic digital speckle pattern interferometry for vibration analysis of microsystem

In this paper, vibration measurement and analysis of microsystems, such as micro-electro-mechanical systems (MEMS) by using stroboscopic digital speckle pattern interferometry (DSPI) is presented. Because of the speckle interferometry, the technique is suited for samples which have a rough surface or whose surfaces can be sprayed into a scattering surface. A laser speckle microinterferometer incorporated with optoelectronic devices for a stroboscopic illumination and a synchronization of the signals between excitation and stroboscopic illumination is described and demonstrated. The system can measure both out-of-plane and in-plane displacement under either a static or dynamic loading. The fundamental is explained and some applications are demonstrated.