Crack detection in single-crystalline silicon wafers using impact testing

This paper presents acoustic measurements obtained by mechanically exciting vibratory modes in single-crystalline silicon wafers with hairline periphery cracks of different type and location. The data presented shows a dependence of natural frequencies, peak amplitudes and damping levels of four audio vibration modes in the frequency range up to 1000 Hz on crack type and crack location. Data from defective wafers exhibit lower natural frequencies, higher damping levels, and lower peak amplitudes. The results suggest an impact test method may be useful for solar cell crack detection and quality control.