کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
7702386 | 1496858 | 2018 | 22 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Control Al/Mg intermetallic compound formation during ultrasonic-assisted soldering Mg to Al
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
شیمی
شیمی (عمومی)
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Control Al/Mg intermetallic compound formation during ultrasonic-assisted soldering Mg to Al Control Al/Mg intermetallic compound formation during ultrasonic-assisted soldering Mg to Al](/preview/png/7702386.png)
چکیده انگلیسی
To prevent the formation of Al/Mg intermetallic compounds (IMCs) of Al3Mg2 and Al12Mg17, dissimilar Al/Mg were ultrasonic-assisted soldered using Sn-based filler metals. A new IMC of Mg2Sn formed in the soldered joints during this process and it was prone to crack at large thickness. The thickness of Mg2Sn was reduced to 22â¯Î¼m at 285â¯Â°C when using Sn-3Cu as the filler metal. Cracks were still observed inside the blocky Mg2Sn. The thickness of Mg2Sn was significantly reduced when using Sn-9Zn as the filler metal. A 17â¯Î¼m Mg2Sn layer without crack was obtained at a temperature of 200â¯Â°C, ultrasonic power of Mode I, and ultrasonic time of 2â¯s. The shear strengths of the joints using Sn-9Zn was much higher than those using Sn-3Cu because of the thinner Mg2Sn layer in the former joints. Sn whiskers were prevented by using Sn-9Zn. A cavitation model during ultrasonic assisted soldering was proposed.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Ultrasonics Sonochemistry - Volume 46, September 2018, Pages 79-88
Journal: Ultrasonics Sonochemistry - Volume 46, September 2018, Pages 79-88
نویسندگان
Zhiwu Xu, Zhengwei Li, Jiaqi Li, Zhipeng Ma, Jiuchun Yan,