کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
7703305 1496862 2018 33 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Copper electroplating of PCB interconnects using megasonic acoustic streaming
موضوعات مرتبط
مهندسی و علوم پایه شیمی شیمی (عمومی)
پیش نمایش صفحه اول مقاله
Copper electroplating of PCB interconnects using megasonic acoustic streaming
چکیده انگلیسی
In this research experimental and simulated analysis investigates the influence of megasonic (MS; 1 ± 0.05 MHz) acoustic-assisted electroplating techniques, with respect to the fabrication of through-hole via (THV) and blind-via (BV) interconnects for the Printed Circuit Board (PCB) industry. MS plating of copper down THV and BV interconnects was shown to produce measurable benefits such as increased connectivity throughout a PCB and cost savings. More specifically, a 700% increase of copper plating rate was demonstrated for THVs of 175 µm diameter and depth-to-width aspect ratio (ar) of 5.7:1, compared with electrodeposition under no-agitation conditions. For BVs, a 60% average increase in copper thickness deposition in 150 µm and 200 µm, ar 1:1, was demonstrated against plating under standard manufacturing conditions including bubble agitation and panel movement. Finite element modelling simulations of acoustic scattering revealed 1st harmonic influence for plating rate enhancement.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Ultrasonics Sonochemistry - Volume 42, April 2018, Pages 434-444
نویسندگان
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