کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
770341 | 1463069 | 2016 | 17 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Effects of film thickness on critical crack tip opening displacement in single-crystalline and polycrystalline submicron Cu films
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
سایر رشته های مهندسی
مهندسی مکانیک
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Effects of film thickness on critical crack tip opening displacement in single-crystalline and polycrystalline submicron Cu films Effects of film thickness on critical crack tip opening displacement in single-crystalline and polycrystalline submicron Cu films](/preview/png/770341.png)
چکیده انگلیسی
We performed in-situ field emission scanning electron microscopy fracture toughness tests on single-crystalline and polycrystalline submicron-thick Cu films. In all specimens, the notch root became blunt, and a crack was initiated from the blunted notch root. The critical crack tip opening displacement (CTOD) for crack initiation, δi, was thickness dependent, where δi decreased with a decrease in the thickness. The critical CTOD normalized by the thickness, δi/B, values of the films were similar (δi/B = 1.4–1.9), irrespective of the film thickness and microstructure. This suggested that the local fractures of the submicron Cu films were similar.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Engineering Fracture Mechanics - Volume 159, July 2016, Pages 98–114
Journal: Engineering Fracture Mechanics - Volume 159, July 2016, Pages 98–114
نویسندگان
Hiroyuki Hirakata, Takuya Yoshida, Toshiyuki Kondo, Kohji Minoshima,