کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
770491 1463131 2012 8 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Transient thermal fracture and crack growth behavior in brittle media based on non-Fourier heat conduction
موضوعات مرتبط
مهندسی و علوم پایه سایر رشته های مهندسی مهندسی مکانیک
پیش نمایش صفحه اول مقاله
Transient thermal fracture and crack growth behavior in brittle media based on non-Fourier heat conduction
چکیده انگلیسی

In this paper, transient thermal fracture problem corresponding to non-Fourier heat conduction theory in a semi-infinite medium with a surface crack is studied. By Laplace transform and Laplace inverse transform, the analytical solution of the temperature field is obtained. The thermal stress on the crack surface is performed by virtue of the temperature field obtained and superposition method. The thermal stress intensity factor is given in numerical integration form. Crack propagation behavior is discussed and comparison of the results from the Fourier and non-Fourier heat conduction models is also made. It is found that the non-Fourier model is safer than the Fourier model in predicting the thermal shock fracture strength of brittle media.


► Thermal fracture based on non-Fourier heat conduction for a semi-infinite medium is studied.
► Comparison of the results from the Fourier and non-Fourier heat conduction models is made.
► Crack starts propagate unstably earlier for non-Fourier model than for Fourier model.
► The significance of non-Fourier effect for studying the thermal shock fracture behavior of brittle materials is justified.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Engineering Fracture Mechanics - Volume 94, November 2012, Pages 29–36
نویسندگان
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