Dominant stress region for crack initiation at interface edge of microdot on a substrate

In order to examine the mechanics of crack initiation at the free interface edge of a microcomponent on a substrate, delamination tests are carried out for two specimen shapes of Cr microdots on a SiO2 substrate. The microdots of the first specimen are shaped like the frustum of a round cone. The Cr microdots are successfully delaminated from the SiO2 substrate in a brittle manner and the critical load is measured by atomic force microscopy (AFM) with a lateral loading apparatus. Stress analysis reveals that a singular stress field exists near the interface edge and the strength for the crack initiation is governed by the intensified normal stress field. The critical stress intensity parameter is evaluated as KσC ≈ 0.24 MPa m0.39. Similar delamination tests are conducted for microdots shaped like the frustum of an oval cone. The stress distributions at the crack initiation of this specimen shape show a higher normal stress than the first specimen shape in the region near the interface edge of about x < 40 nm, while it is lower in the region of about x > 50 nm (x: distance from the edge). This suggests a limitation of conventional fracture mechanics: namely, the crack initiation in these specimens is not uniquely governed by the intensity of the singular field. It is found that the delamination crack is initiated when the averaged stress σya in the region of 90–130 nm reaches 190–270 MPa, regardless of the specimen shape. This indicates that the dominant stress region of crack initiation is roughly estimated as 90–130 nm and the criterion is given in terms of the averaged stress in the region.