Homogenization of delamination growth in an ACA flip-chip joint based on micropolar theory

In the present paper the delamination mechanism of a typical internal structure of the anisotropic conductive adhesive (ACA) interconnect for electronic packaging is modeled on the basis of micropolar theory and computational homogenization. The interface is treated as a finite Representative Volume Element (RVE), across which the macroscopic deformation is expressed in terms of regularized strong displacement and rotational discontinuities. For the microstructure of the RVE, the micro-macro kinematical coupling is considered as a Taylor series expansion in the regularized macroscopic discontinuities, and, connected to that, a discontinuous fluctuation field representing the microstructural variation is included to describe delamination on the microlevel. As to the microlevel delamination modeling, on the basis of the discontinuous fluctuation field, a damage coupled to slip and dilation formulation is used to model the interface degradation. The constitutive relations are established in a thermodynamic setting, where the interfacial free energy involves internal variables of damage and plastic deformation. The parameters of the interface are calibrated so that a predefined amount of fracture energy is dissipated in mode I. In the numerical example, the response of a planar interface is considered when it is subjected to the basic modes I-II and also the non-conventional rotational discontinuity mode. Case studies on fracture and geometry parameters have also been carried out. Finally, an uncoupled thermomechanical analysis of a microsystem involving a representative ACA microstructure has been made for the understanding of the microscopic delamination during a thermal cycling procedure.