کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
777543 | 1463541 | 2007 | 7 صفحه PDF | دانلود رایگان |
The effects of plasma treatment on the surfaces of the flame resistant-4 (FR-4) and copper substrates are investigated in terms of X-ray photoelectron spectroscopy (XPS), contact angle, and atomic force microscopy (AFM). The adhesion strengths of the underfills/FR-4 substrate and underfills/copper substrate are also studied. As experimental results, the plasma treatments of FR-4 and copper substrate surfaces yield several oxygen complexes in hydrophilic surfaces, which can play an important role in increasing the surface polarity, wettability, and adhesion characteristics of the underfills/substrates. And, the curing temperature ranges of the underfills, which have the maximum adhesion strength of the underfills/FR-4 substrate and underfills/copper substrate, were 140–150 °C.
Journal: International Journal of Adhesion and Adhesives - Volume 27, Issue 3, April 2007, Pages 200–206