کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
782621 1465046 2010 6 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Dependence of pad performance on its texture in polishing mono-crystalline silicon wafers
موضوعات مرتبط
مهندسی و علوم پایه سایر رشته های مهندسی مهندسی مکانیک
پیش نمایش صفحه اول مقاله
Dependence of pad performance on its texture in polishing mono-crystalline silicon wafers
چکیده انگلیسی

Mono-crystalline silicon wafers are important materials in the semiconductor industry for fabricating integrated circuits and micro-electro-mechanical systems. To ensure high surface integrity of polished wafers, the effect of pad texture and its variation on the pad performance needs to be understood. This paper studies experimentally the dependence of pad performance on its texture deterioration by investigating its correlation with polishing time, polishing pressure, and material removal rate. The study concludes that material removal rate decreases as the cylindrical cell structure of a pad is gradually deteriorated, that there is a pad life limit beyond which polishing quality can no longer be maintained, and that the workable pad life can be extended to a certain degree by applying higher polishing pressure.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: International Journal of Mechanical Sciences - Volume 52, Issue 5, May 2010, Pages 657–662
نویسندگان
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