کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
783021 | 1465082 | 2007 | 9 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Heating of a uniform wafer disk
دانلود مقاله + سفارش ترجمه
دانلود مقاله ISI انگلیسی
رایگان برای ایرانیان
کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
سایر رشته های مهندسی
مهندسی مکانیک
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Heating of a uniform wafer disk Heating of a uniform wafer disk](/preview/png/783021.png)
چکیده انگلیسی
The closed-form heating response of a thin uniform circular wafer is obtained, in view of a new processing method for semiconductor materials. A strain energy formulation is obtained expeditiously using Gaussian curvature and associated structural concepts. The method is developed for generally curved wafers, which accounts for flat, spherical, cylindrical and twisted shapes. Solutions for the first two types become available in closed form, and the deformation can exhibit a sudden change in axi-symmetrical response or a snap-through buckling, or both: for the latter two types, a numerical solution points to progressive deformation in both without buckling. All results are shown to compare rather well with finite element analysis.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: International Journal of Mechanical Sciences - Volume 49, Issue 2, February 2007, Pages 230–238
Journal: International Journal of Mechanical Sciences - Volume 49, Issue 2, February 2007, Pages 230–238
نویسندگان
K.A. Seffen, R.A. McMahon,