Stress concentration factor due to a circular hole in functionally graded panels under uniaxial tension

The effect of the material property inhomogeneity on the stress concentration factor (SCF) due to a circular hole in functionally graded panels is numerically investigated. The multiple isoparametric finite element formulation is used to simulate the elastostatic boundary value problem. A parametric study is performed by varying the functional form and the direction of the material property gradation. The material property inhomogeneity is characterized by the intrinsic inhomogeneity length scale, modulus ratio and the power-law index. The results from our parametric study showed that the SCF is reduced when Young's modulus progressively increased away from the hole. The angular position of the maximum tensile stress on the surface of the hole remains unaffected by the material property inhomogeneity. The SCF is seen to be most influenced by the power-law index, followed by the variation of the inhomogeneity length scale. The SCF is least affected by the modulus ratio.