Micro-end-milling of single-crystal silicon

Ductile-regime machining of silicon using micro-end-mill is almost impossible because of the brittle properties of silicon, crystal orientation effects, edge radius of the cutter and the hardness of tool materials. Micro-end-milling can potentially be used to create desired three dimensional (3D) free form surface features using the ductile machining technology for single-crystal silicon. There is still a lack of fundamental understanding of micro-end-milling of single-crystal silicon using diamond-coated tool, specifically basic understanding of material removal mechanism, cutting forces and machined surface integrity in micro-scale machining of silicon. In this paper, further research to understand the chip formation mechanism was conducted. An analysis was performed to discover how the chips are removed during the milling process. Brittle and ductile cutting regimes corresponding to machined surfaces and chips are discussed. Experiments have shown that single-crystal silicon can be ductile machined using micro-end-milling process. Forces generated when micro-end-milling single-crystal silicon are used to determine the performance of the milling process. Experimental results show that the dependence of the cutting force on the uncut chip thickness can be well described by a polynomial function order n. As cutting regime becomes more brittle, the cutting force has more complex function.