A general approach in evaluating and optimizing thermoelectric coolers

In this paper, a general approach in evaluating and optimizing thermoelectric cooler (TEC) performance is presented. Analytical solutions for performance parameters such as cooling capacity and device temperature at both the TEC pellet level and module level are derived in simplified formulation based on the TEC thermal balance equations. The major advantage of the present solutions lies in the fact that the optimal TEC performances can be determined in a straightforward manner, as against the iterative procedure mostly reported in literature. In addition, the module level analysis facilitates the TEC optimization without prior knowledge of pellet details and dimensions. The validity of the present analysis approach is demonstrated by examining TECs of different cooling capacities. Furthermore, the optimization of device temperature for microprocessors under TEC enhanced air cooling and liquid cooling conditions is examined. The effect of hot side to cold side temperature difference is discussed and the thermal resistances at both hot and cold sides are also analyzed within given performance parameters.