کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
790953 901898 2014 9 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Joining with electrochemical support (ECUF): Cold pressure welding of copper
موضوعات مرتبط
مهندسی و علوم پایه سایر رشته های مهندسی مهندسی صنعتی و تولید
پیش نمایش صفحه اول مقاله
Joining with electrochemical support (ECUF): Cold pressure welding of copper
چکیده انگلیسی

Joining metals using electrochemical support (ECUF) is a new process for cold pressure welding sheets and parts. This new process is based on an electrochemical in-line surface treatment followed by incremental pilger rolling. The ECUF process intends to cold pressure weld materials under optimized conditions. Oxide layers on metal surfaces are known to inhibit the formation of cold pressure welds. The in-line electrochemical treatment will be used to remove these surface oxides for specific engineering metals and alloys. Hence, an improved pressure weld formation at lower forces and smaller reduction ratios is expected for the electrochemically treated surfaces. Using a more flexible pressure welding process, the number of applications could be greatly improved. First tests with copper were performed to analyse the efficiency of the proposed electrochemical surface treatments. Two electrochemical treatments, the cathodic oxide-reduction and cyclovoltammetric oxide-reduction, were compared with conventional treatments (degreasing and scratch brushing) regarding their influence on the cold pressure welding process of copper. The weld strength of lap welds has been investigated as well as the necessary reduction threshold to form a weld. It was found that the electrochemical oxide reduction resulted in higher weld strength. The results of scanning electron microscopy (SEM) and energy dispersive analysis of X-rays (EDX) indicate that surface oxides were successfully removed by the electrochemical surface treatments.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Journal of Materials Processing Technology - Volume 214, Issue 10, October 2014, Pages 2179–2187
نویسندگان
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