Abrasive jet micro-machining of planar areas and transitional slopes in glass using target oscillation

Analytical models are presented which allow the prediction of the shape, sidewall slope, and depth of abrasive jet micro-machined planar areas and transitional slopes in glass using a novel technique in which the target is oscillated transversely to the overall scan direction. A criterion was developed to establish the minimum oscillation velocity to ensure negligible surface profile waviness in the scanning direction. If the oscillation velocity is sufficiently greater than the scanning velocity, the target receives an approximately uniform energy flux, resulting in a high degree of flatness for both masked and unmasked planar areas micro-machined in glass. It was also found that particle scattering from the mask edge caused the sidewalls of a planar area to be very shallow, on the order of a few degrees. Two methods were investigated to machine planar areas with increased sidewall slope using target oscillation: (i) machining micro-channels adjacent to the planned planar area, and (ii) target oscillation with an obliquely oriented nozzle. Among these two methods, target oscillation with an obliquely oriented nozzle created steeper sidewalls and was easier to implement, but it also caused appreciable mask under-etching. A major distinction between the target oscillation approach and a previously published method that was based on the superposition of the erosion profiles of adjacent nozzle scans, is that the latter is capable of machining an arbitrary surface profile over a large area, whereas the present target oscillation technique is intended only for the machining of flat planar areas at a single elevation. For such applications it is the preferred approach.