Dendrite-free Na metal plating/stripping onto 3D porous Cu hosts

Prestoring metallic Na in a Copper nanowire-reinforced 3D Cu foam current collector by electrodepositing, which guides uniform Na plating via Cu nanowires with the formation of stable SEI films, accommodates sufficient Na in the porous structure to achieve a reversible plating/stripping process with large areal loadings and efficiently utilizes deposited Na to maximum the energy density of Na-based batteries, can extremely enhance the stability of Na metal anode.462