کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
798484 903269 2009 9 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Computer-based monitoring of the polishing processes using LabView
موضوعات مرتبط
مهندسی و علوم پایه سایر رشته های مهندسی مهندسی صنعتی و تولید
پیش نمایش صفحه اول مقاله
Computer-based monitoring of the polishing processes using LabView
چکیده انگلیسی

Despite of an extensive scientific research regarding the polishing technologies of a variety of materials, the mechanisms and interactions of the single components in the process are still not fully understood. In order to facilitate the research activities in the field of polishing the usage of computer-based data acquisition and analysis is recommended. A high data rate provides the researcher an appropriate density of information which can be used to enhance the evaluation of stated hypothesis. This is normally based on various inspection methods which only take place after the processing of the sample, e.g. white light interferometry and scanning electron microscopy. A solution for further elaborating the scientific insight on the removal mechanisms and relevant interactions during the process and enhancing the process stability and reproducibility is the monitoring of the significant chemical, mechanical and thermal indicators. Therefore, a variety of sensors and measurement devices are installed and used to gather data during the process duration (e.g. pH value, conductivity, polishing work, coefficient of friction). The amount of different devices and high data rates requires a computer-based tool to realise an adequate online process monitoring. Thus, a monitoring tool based on the LabView environment was implemented which enables the researcher to use the whole opportunities of computer-based data processing. Examples of the functionality are given for the validation of the polishing behaviour of silicon nitride.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Journal of Materials Processing Technology - Volume 209, Issue 20, 19 November 2009, Pages 6039–6047
نویسندگان
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