Characterization of the drilling alumina ceramic using Nd:YAG pulsed laser

Laser micromachining can replace mechanical removal methods in many industrial applications, particularly in the processing of difficult-to-machine materials such as hardened metals, ceramics, and composites. It is being applied across many industries like semiconductor, electronics, medical, automotive, aerospace, instrumentation and communications. Laser machining is a thermal process. The effectiveness of this process depends on thermal and optical properties of the material. Therefore, laser machining is suitable for materials that exhibit a high degree of brittleness, or hardness, and have favourable thermal properties, such as low thermal diffusivity and conductivity. Ceramics which have the mentioned properties are used extensively in the microelectronics industry for scribing and hole drilling.Rapid improvement of laser technology in recent years gave us facility to control laser parameters such as wavelength, pulse duration, energy and frequency of laser. In this study, Nd:YAG pulsed laser (with minimum pulse duration of 0.5 ms) is used in order to determine the effects of the peak power and the pulse duration on the holes of the alumina ceramic plates. The thicknesses of the alumina ceramic plates drilled by laser are 10 mm. Average hole diameters are measured between 500 μm and 1000 μm at different drilling parameters. The morphologies of the drilled materials are analyzed using optical microscope. Effects of the laser pulse duration and the peak power on the average taper angles of the holes are investigated.