کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
800155 1467166 2006 31 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Microstructure dependent viscoplastic damage modelling of tin–lead solder
موضوعات مرتبط
مهندسی و علوم پایه سایر رشته های مهندسی مهندسی مکانیک
پیش نمایش صفحه اول مقاله
Microstructure dependent viscoplastic damage modelling of tin–lead solder
چکیده انگلیسی

A theoretical framework describing the nonlinear mechanical behaviour of multiphase solders is introduced, along with its numerical implementation. Next to viscoplasticity, damage has been included in the model using a gradient-enhanced nonlocal damage description. Microstructural data are accounted for in the model by means of a phase field. In here, the methodology followed is generic and can be readily extended to numerous multi-phase materials. The model is applied to the eutectic Sn–Pb system whose mechanical properties are known to be heavily dependent on the underlying microstructure. The results indicate that coarser microstructures exhibit a more pronounced localisation behaviour compared to finer ones leading to higher local values for the stresses and viscoplastic strains. Furthermore, different damage evolution behaviour is observed for the investigated microstructures, with a coarser microstructure leading to earlier microstructural failure.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Journal of the Mechanics and Physics of Solids - Volume 54, Issue 12, December 2006, Pages 2621–2651
نویسندگان
, , ,