Microstructure influencing physical and mechanical properties of electrolytic tough pitch copper produced by equal channel angular pressing

Samples of electrolytic tough pitch (ETP) copper were subjected to equal-channel angular pressing (ECAP) for up to 16 passes at room temperature following route Bc. The microstructural evolution was followed by Oriented Image Microscopy (OIM) and Differential Scanning Calorimetry (DSC) was used to estimate the activation energy and the recrystallization temperature after each ECAP pass. Also, mechanical properties after each pass were evaluated by tensile tests. Finally, electrical properties were analyzed. Results show that the stored energy increases on increasing ECAP deformation, while the recrystallization temperature decreases significantly. From a mechanical point of view a stable state is attained after 4 passes. Similarly, electrical conductivity slightly decreases down to a saturation state.